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HLK-RM60
  • HLK-RM60

RM60|WiFi6无线路由模模块

物联网网关&存储/智能家居/ PageView : 12173

高性能/低时延/覆盖广/传输快/OpenWrt开发

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全千兆WiFi6无线通信模块

        小尺寸   高性能   高带宽   覆盖广


支持IEEE 802.11ax

           


无线速率达1200Mbps

           


联发科方案MT7621A
+MT7905+MT7975

           


支持双串口五千兆网口,
OpenWrt二次开发

       

产品特征

PRODUCT FEATURES

RM60采用联发科SOC芯片,采用双核四线程主控芯片MT7621A,和MT7905+MT7975。支持2.4G/5.8G频段,速率高达573+1201Mbps,802.11ac独特调制方式支持同时挂载128个终端。

技术规格

TECHNICAL SPECIFICATIONS

基本参数

网络标准无线标准:IEEE 802.11a/b/g/n/ac/ax
有线标准:IEEE 802.3, IEEE802.3u

频率范围2.412-2.4835GHz    5.180-5.825GHz

发射功率14-22dBm

接收灵敏度73dBm~88dBm

信道数2.4G频段:1-14 5.8G频段:36-173

天线

天线类型外置天线(2.4G天线*2+5.8G天线*2)

功能参数

wifi工作模式Router/AP/STA/AP Client/Bridge

无线安全无线 MAC 地址过滤/无线安全功能开关
64/128/152位WEP加密
WPA-PSK/WPA2-PSK,WPA/WPA2
安全机制

串口转网络

串口波特率1200~500000bps(支持非标准波特率)

TCP/UDP连接100

硬件参数

芯片方案MT7621+MT7905+MT7975

CPUMT7621A:880MHz 双核四线程

内存/Flash128MB/16MB

硬件接口UART/I²C/PWM/GPIO/SPI/USB2.0&3.0

工作电压3.3V(单模块)

工作电流持续发送>=~800mA平均/1000mA峰值
正常模式>=~750mA平均/800mA峰值

外观尺寸60*90*2.8mm

环境标准工作温度:-20~+60℃
工作湿度:10%-90%RH(不凝结)
存储温度:(-40~+85℃)
存储湿度:5%-90%RH(不凝结)

供电要求

电源输入电压3.0-3.6VDC(典型3.3VDC)

I/O电压3.0-3.6VDC(典型3.3VDC)

供电电流要求>=1500mA(典型)

供电电源纹波 <=50mV< /span>


产品测试套件

PRODUCT TEST KIT

Specification:


Items
Parameters
Model Number HLK-RM60
Main Chipset MT7621
Kernel MIPS1004Kc
Main frequency 880MHz
RAM DDR2 128MB
Flash 16MB
Temperature Ambient temperature-20℃~60℃
Humidity Using10~95%Non-condensing) Stock5~95%Non-condensing
Size 900mm×600mm


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